Hot-Press Boron Nitride BN Ceramic for Vacuum Furnace
ZG Industrial Ceramic Technoloy, a new materials high-tech company, is a professional manufacturer and trader specialized in the research, development and production of non-oxide ceramics products and carbon-carbon composites products. The company founded a professional team which has rich experience in high-temperature ceramics for vacuum hot pressing sintering area.
The company has several vacuum or atmosphere hot pressing sintering production lines. The main products are
- hot pressed boron nitride products
- hot pressed boride titanium products
- hot pressed boron nitride or aluminum nitride composite
- machinable ceramic products with high insulation, high thermal conductivity and low loss
- aluminum nitride ceramic substrate
- hot pressed aluminum nitride ceramic plate
- various specifications of ceramic evaporation boats for evaporation aluminum plating
- amorphous magnetic materials ribbon
- boron nitride composite ceramic nozzle and guide tube for atomized metal powder production
- carbon-carbon composite ring for hot pressing sintering die
Based on the principle of "integrity-based, quality first", the company has won the support and praise of the majority of customers in the industry. We will provide you with high quality service with 100 percent enthusiasm if you have any request.Because we are proficient, so we know why is that!Because we are practiced, so we know how to do it!You've found us, you've got the answer!
Boron Nitride Nozzle Basic Information & Materials
| Typical Properties |
BN-H |
BN99 |
BN-Ca |
BN-A |
BN-B |
BN-C |
BN-D |
BN-E |
| Composition |
hBN>99% |
hBN>99% |
hBN>98.5% |
hBN+AL+SI |
hBN+AL+ZR |
hBN+SIC |
hBN+ZrO2 |
hBN+ALN |
| Binder |
B2O3 |
B2O3 |
B2O3 |
B2O3+Al2O3+SiO2 |
B2O3+Al2O3 |
B2O3 |
B2O3+Al2O3 |
B2O3+Al2O3 |
| Color |
White |
White |
White |
White Graphite |
White Graphite |
Greyish-Green |
White Graphite |
Greyish-Green |
| Typical Density (g/cm3) |
1.55~1.6 |
1.85~1.98 |
1.98~2.03 |
2.25~2.35 |
2.25~2.35 |
2.40~2.50 |
2.25~2.95 |
2.45~2.95 |
| Thermal Properties |
Max. Using Temperature (°C)
In Air
In Inert In Vacuum |
900
2100
1900 |
900
2100
1900 |
900
2100
1900 |
1000
1750
1750 |
1000
1700
1700 |
1000
1700
1700 |
1000
1800
1800 |
1000
1800
1800 |
Thermal Expansion
(RT·1000 °C ) (10-6/K) |
1.5 |
1.5 |
1.5 |
2 |
2 |
2.8 |
3.5 |
2.8 |
| Thermal Conductivity (W/mk) |
15 |
35 |
35 |
30 |
30 |
40 |
30 |
85 |
| Electrical and Mechanical Properties |
| Electrical Resistiity (Ω/cm) |
>1014 |
>1014 |
>1014 |
>1013 |
>1013 |
>1012 |
>1012 |
>1013 |
| Bending Strength (MPa) |
28 |
30 |
30 |
65 |
65 |
80 |
90 |
90 |
| Compressive Strength(MPa) |
50 |
55 |
55 |
145 |
145 |
175 |
220 |
220 |
| Typical Applications |
high-temperature
Vacuum |
High-Temperature
Vacuum |
High-Temperature
Vacuum |
Powder
Metallurgy |
Powder
Metallurgy |
Powder
Metallurgy |
Metal Casting |
Powder
Metallurgy |
| lnlustratior for High-Temperature Furnace |
✓ |
✓ |
✓ |
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✓ |
| Crucibles for Metal Evaporation |
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✓ |
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✓ |
| Parts for Melting Metals or Glass |
✓ |
✓ |
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✓ |
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✓ |
✓ |
✓ |
| Casting Mold for Metals or Alloys |
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✓ |
✓ |
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✓ |
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| Support Parts for High-Temperature |
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✓ |
✓ |
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| Pipes or Nozzles for Liquid Metal Handling |
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| Crucibles for Ceramic Sinter |
✓ |
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Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (HBN) or white graphite.
Material of Boron Nitride Ceramics
- Pyrolytic Boron Nitride: 99.99% Boron Nitride*
- 99 Boron Nitride: Boron Nitride + Boric Oxide (B2O3)
- CABN: Boron Nitride + Calcium Borate
- ALBN: Boron Nitride + Al2BO3
- ZRBN: Boron Nitride + Zirconium Oxide + Boric Oxide (B2O3)
- ZABN: Boron Nitride + Zirconium Oxide + Aluminum Nitride + Al2BO3
- SCBN: Boron Nitride + Silicon Carbon + Al2BO3
Processing of Boron Nitride Ceramics
- Hot Pressed Sintering
- Chemical Vapor Deposition
Applications of Boron Nitrides Ceramics
- Thermal Management
Excellent electrical insulation and thermal conductivity make BN very useful as a heat sink in high-power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide, and other electronic packaging materials, and are easier machinable to desired shapes and sizes.
- High Temperature Environments
Temperature stability and excellent resistance to thermal shock make BN the ideal material in the toughest high-temperature environments such as equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing.
- Molten Metal Handling
BN is inorganic, inert, nonreactive with halide salts and reagents, and is not wet by most molten metals and slags. These characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processes.
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